October 24th, 2007 by
Cold Heat Solder
Oct 16, 2007 12:00 AM (7 days ago) From Dow Corning Corp., Distributed by Press Release
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October 17th, 2007 by
Cold Heat Solder
Dow Corning Corp. today introduced three new two-part high refractive index silicone encapsulants to serve the fast-growing light-emitting diode market.
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October 17th, 2007 by
Cold Heat Solder
LTM46088A Series 8 A DC/DC uModule(TM) regulator system features on-board dc/dc controller, power switches, inductor compensation, and input/output bypass capacitors. Operating from supply range of 2.375-5.5 V, 6 V max, unit regulates output voltage from 0.8-5 V and can be paralleled to deliver up to 60 W to load while evenly sharing current. It offers tracking for controlled ramp-up, ramp-down, …
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October 17th, 2007 by
Cold Heat Solder
Oct 16, 2007 12:00 AM (10 hrs ago) From Dow Corning Corp., Distributed by Press Release
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October 14th, 2007 by
Cold Heat Solder
A fire which destroyed a house Friday at 1836 Culbertson Ave. in New Albany is still under investigation, according to New Albany Fire Chief Stan Mason. The fire broke out around 7 p.m.
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October 12th, 2007 by
Cold Heat Solder
Featuring single unit construction for protection from harsh elements, WT and WR series switches are constructed of heat resistant resin meeting UL94V-0 flammability ratings. Available in various circuit configurations, they include switching mechanism for breaking light welds, qualifying them to IEC 61058 (UL 61058-1). WT series of toggles are rated at 10 A at 125 Vac and 6 A at 250 Vac or 10 A …
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October 12th, 2007 by
Cold Heat Solder
Irvine, California, September 17, 2007 Henkel to Share Materials Expertise at Upcoming IPC Midwest and SMTA International Events At the forthcoming IPC Midwest and SMTA International electronics events, Henkel will not only showcase its latest materials innovations, but will also use each opportunity to share its vast materials knowledge base with show delegates. Top Henkel research and …
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October 10th, 2007 by
Cold Heat Solder
Price reduction to follow
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October 10th, 2007 by
Cold Heat Solder
Nextreme claims to have solved the overheating problem with modern flip-chips with its thermal copper pillar bumps, which can either help cool chips, or can be used in reverse to generate energy from waste heat.
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October 10th, 2007 by
Cold Heat Solder
Nextreme’s thermal copper pillar bumps for flip-chips solves cooling problems, while simultaneously offering power-scavenging applications as a way to generate energy from heat.
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